Back to engineering archive

Record 080 / Engineering studies

Wearable PCB and enclosure study

A study of electronics and mechanical fit for a smart ring concept, using a rigid-flex PCB within a constrained enclosure.

Design study
Rigid flex PCBWearable electronicsMechanical envelopePCB concept

Technical notes

Mechanical envelope

A ring offers a narrow, curved volume rather than a conventional flat board area. The study considers component placement in relation to that envelope and the space available around the wearer’s finger.

Rigid-flex concept

The PCB concept uses the ring geometry to organise the electronics. Rigid component regions and their connecting sections are considered together with enclosure shape, rather than resolving the circuit and mechanical package independently.

Board and enclosure fit

The CAD study shows the proposed board and enclosure arrangement. It examines the geometry and placement choices that shape later electrical and mechanical development.

Engineering archiveArchive record

Project enquiries

Discuss your project.

Tell us what you’re developing and where you need engineering support.

Discuss your project